XTech
Home > Products > AdvancedTCA Solutions > AMC/FMC Panels



AMC and FMC Panels

XTractor

The XTractor is a handy device for removing AMC modules from MicroTCA chassis or AMC carriers.
The XTractor is a handy device for removing AMC modules from MicroTCA chassis or AMC carriers.

Cabling, the close proximity to other boards, and small surface areas can complicate the removal of modules. The XTractor offers an easier grasp for facilitating in-house board testing, field service replacement and debugging situations."

The XTech XTractor uses an ergonomic design with an injection-molded nylon handle, a stainless steel hook and key ring. It can also be customized with corporate logos, labeling and colors.

Download the XTractor data sheet (PDF 3MB)


2hp AMC Extender

2hp AMC Extender
XTech introduces the 2hp AMC Extender, enabling the conversion of existing mid-size modules for use in a full-size module envelope.

The unique extender works with single and double width extruded front panels from XTech. It forms a tight labyrinth, ensuring a rigid assembly and an EMI seal. It's also compatible with both AMCV.0 release and 1.0 and 2.0 configurations.

Download the 2hp AMC Extender data sheet
(PDF 1.7kb)



XTech customizable extensions for managing wires and cables

XTech customizable extensions for managing wires and cables
XTech's integral extensions for full-size AMC and MicroTCA modules offer a solution for managing wires and cable around chassis. The aluminum extension is strong, sturdy and powder-coated to minimize wire friction. The extension can also be labeled, if needed. The front-protruding wall can be re-configured to meet a wide range of mechanical design specifications.


XTech MicroTCA fastener-reinforced faceplate

XTech MicroTCA fastener-reinforced faceplate XTech's fastener-reinforced MicroTCA faceplates are MicroTCA.0 R1.0-compliant. Inserted into a lightweight, robust aluminum profile, the fasteners provide increased security for use in rough service.

The faceplate's retention flange design uses front locking attachment flanges with M3 captive screws, top and bottom. They are offered in compact, full-size, mid-size configurations at single and double height, and are available as module faceplate assemblies with custom I/O, hot swap latch handles, and light pipes, as well as filler panels and air baffles in aluminum and FR4.

Similar to other XTech AMC and MicroTCA products, the new faceplates are supplied fully assembled, including EMI gaskets. Compliant with MicroTCA.0 R1.0, they save manufacturers the time of devising their own in-house solutions and give the industry a new, ready-to-use integrated product line for MicroTCA systems.


Externally adjustable AMC baffle

Externally adjustable AMC baffle
XTech's new externally adjusted AMC baffle uses a faceplate mounted control knob to control airflow. With the external control knob, users can direct airflow away from blank boards and towards the active boards where the flow is most needed.


FMC* Mounting System

FMC (FPGA Mezzanine Card) XTech's FMC* mounting system includes the new FMC bezel, gasket, and mating AMC faceplate solution in Full or Mid size form factors, custom configured to your application requirements. The FMC form factor enables AMC and PMC technologies to merge in a new, mechanically sound solution.

* FPGA Mezzanine Card


AMC faceplates


AMC front panels and faceplates
Available in full, mid and compact sizes

AMC front panels and faceplates now avaiable in R2.0
Now available R 2.0

Custom AMC front panel assemblies
Full mechanical assembly with Components

AMC front panels and faceplates available in all standard sizes, In single or double width
All standard sizes, In single or double width

AMC front panels and faceplates available in aluminum, steel, or plastic
Available in aluminum, steel, or plastic*

AMC front panels and faceplates can be customized for each appl,ication and in this example you can see a light pipe housing for improved light separation
Light pipe housing for improved light separation



*XTech has been testing various conductive plastics that may be usable in faceplate applications. Further testing may be required to validate its feasibility with specific applications.